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  preliminary data this is preliminary information on a new product now in deve lopment or undergoing evaluation. details are subject to change without notice. august 2011 doc id 022118 rev 1 1/12 12 L3G3250A mems motion sensor: three-axis analog gyroscope features two selectable full scales (625/2500 dps) embedded self-test wide supply voltage range: 2.4 v to 3.6 v embedded power-down and sleep mode embedded low-pass filter integrated high-pass filter reset high shock survivability extended operating temperature range (-40 c to 85 c) ecopack ? rohs and ?green? compliant applications gaming and virtual reality input devices motion control with mmi (man-machine interface) gps navigation systems appliances and robotics description the L3G3250A is a low-power three-axis angular rate sensor. it includes a sensing element and an ic interface capable of providing the measured angular rate to the external world via three analog outputs. the sensing element is manufactured using a dedicated micro-machining process developed by stmicroelectronics to produce inertial sensors and actuators on silicon wafers. the ic interface is manufactured using a cmos process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics. the L3G3250A is available in a plastic land grid array (lga) package and can operate within a temperature range from -40 c to +85 c. lga-16 (3.5x3.0x1.0 mm) table 1. device summary order code temperature range (c) package packing L3G3250A -40 to +85 lga-16 (3.5x3.0x1.0) tray L3G3250Atr -40 to +85 lga-16 (3.5x3.0x1.0) tape and reel www.st.com
contents L3G3250A 2/12 doc id 022118 rev 1 contents 1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4.1 sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4.2 zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4.3 self-test (st) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 sleep mode, self-test and power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6 soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 full scale (fs) pin operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
L3G3250A pin description doc id 022118 rev 1 3/12 1 pin description 1.1 pin description figure 1. pin connection note: the vibration of the structure is maintained by drive circuitry in a feedback loop. the sensing signal is filtered and appea rs as an analog output. (top view) direction s of the detectable angula rate s x s t hp s out_r re s vdd out_p vpump vref vdd 1 +? out_y +? out_r bottom view +? out_p nc out_y gnd f s re s gnd s leep 9 1 3 5 am101 3 5v1 table 2. pin description pin# name function 1 nc internally not connected 2 st self-test pin 3hps high-pass filter reset (?1?: reset of external high-pass filter; ?0?: normal mode) 4 out_y yaw axis angular rate output 5 out_r roll axis angular rate output 6 out_p pitch axis angular rate output 7 vdd power supply 8 res reserved, leave unconnected 9 res reserved, leave unconnected 10 sleep sleep mode selection 11 fs full scale selection 12 gnd 0 v supply voltage 13 gnd 0 v supply voltage 14 vpump charge pump capacitor connection pin (1)
pin description L3G3250A 4/12 doc id 022118 rev 1 15 vref reference output voltage 16 vdd power supply 1. to be connected to gnd through 10 nf, 25 v ceramic capacitor. 1nf min value must be guaranteed under 11 v bias condition. table 2. pin description (continued) pin# name function
L3G3250A mechanical and electrical specifications doc id 022118 rev 1 5/12 2 mechanical and electrical specifications 2.1 mechanical characteristics @ vdd = 3.0 v, t = 25 c unless otherwise noted. table 3. mechanical characteristics (1) symbol parameter test condition min. typ. (2) max. unit fs measurement range 625 dps 2500 so sensitivity fs = 625 dps 2 mv/dps fs = 2500 dps 0.5 sodr sensitivity change vs. temperature 0.017 %/c zrl zero-rate level fs = 625 dps 1.5 v fs = 2500 dps 1.5 vref reference voltage 1.5 v offdr zero-rate level change vs. temperature 0.08 dps/c nl non linearity (3) best fit straight line 2 % fs rn rate noise density 0.015 dps/ bw bandwidth 140 hz top operating temperature range -40 +85 c 1. the product is factory calibrated at 3.0 v. the operational power supply range is specified in table 4 . 2. typical specificat ions are not guaranteed. 3. guaranteed by design. hz
mechanical and electrical specifications L3G3250A 6/12 doc id 022118 rev 1 2.2 electrical characteristics @ vdd = 3.0 v, t = 25 c unless otherwise noted. table 4. electrical characteristics (1) symbol parameter test condition min. typ. (2) max. unit vdd supply voltage - 2.4 3.0 3.6 v idd supply current 6.3 ma iddsl supply current in sleep mode (3) 2ma iddpdn supply current in power-down mode 5 a to p operating temperature range -40 +85 c 1. the product is factory calibrated at 3.0 v. 2. typical specificat ions are not guaranteed. 3. sleep mode introduces a faster turn- on time relative to power-down mode.
L3G3250A mechanical and electrical specifications doc id 022118 rev 1 7/12 2.3 absolute maximum ratings stresses above those listed as ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. note: supply voltage on any pin should never exceed 4.8 v. table 5. absolute maximum ratings symbol ratings value unit vdd supply voltage - 0.3 to 4.8 v vin input voltage on any control pin (sleep, fs, st) -0.3 to vdd +0.3 v t stg storage temperature range -40 to +125 c sg acceleration g for 0.1 ms 10,000 g esd electrostatic discharge protection 2 (hbm) kv this is a mechanical shock sensitive device, improper handling can cause permanent damage to the part this is an esd sensitive device, improper handling can cause permanent damage to the part
mechanical and electrical specifications L3G3250A 8/12 doc id 022118 rev 1 2.4 terminology 2.4.1 sensitivity an angular rate gyroscope is a device that produces a positive-going digital output for counter-clockwise rotation around the sensitiv e axis considered. sensitivity describes the gain of the sensor and can be determined by applying a defined angular velocity to it. this value changes very little over temperature and time. 2.4.2 zero-rate level zero-rate level describes the actual output signal if there is no angular rate present. zero- rate level of precise mems sensors is, to some extent, a result of stress to the sensor and therefore zero-rate level can slightly change after mounting the sensor onto a printed circuit board or after exposing it to extensive mechanical stress. 2.4.3 self-test (st) self-test allows the testing of the mechanical and electric parts of the sensor, allowing the seismic mass to be moved by means of an electrostatic test-force. when the st is activated by the ic, an actuation force is applied to the sensor, emulating a definite coriolis force. in this case the sensor output will exhibit a change in the output. when st is active, the device output is given by the algebraic sum of the signals produced by the velocity acting on the sensor and by the electrostatic test-force. 2.5 sleep mode, self-test and power-down the L3G3250A enables advanced power saving functionality thanks to the different operating modes available. when the device is set in the sleep mode configuration, the reading chain is complete ly turned off, allowing lower powe r consumption. in this condition, the device turn-on time is significantly reduced permitting simpler external power cycling. the user can select the desired operating mode through two dedicated pins. 2.6 soldering information the lga package is compliant with the ecopack ? , rohs and ?green? standard. it is qualified for soldering heat resist ance according to jedec j-std-020. leave ?pin 1 indicator? unconnected during soldering. land pattern and soldering recommendations are available at www.st.com/mems . table 6. sleep mode, self-test and power-down mode configuration operating mode st pin sleep pin normal mode 0 0 power-down 0 1 self-test 1 0 sleep mode 1 1
L3G3250A application hints doc id 022118 rev 1 9/12 3 application hints figure 2. L3G3250A electrical connections and external component values note: the capacitor on pin 14 must guarantee a 1 nf value under 11 v bias condition. power supply decoupling capacitors (100 nf ceramic or polyester + 10 f aluminum) should be placed as near as possible to the device (common design practice). a 10 nf, 25 v class capacitor connected to pin 14 is required for proper operation of the device. 3.1 full scale (fs) pin operation figure 3. fs pin operation 9nf 100 nf vdd gnd gnd 10 f gnd (top view) direction s of the detectable angular rate s x +? out_y +? out_r +? out_p vpump gnd 10 nf (25v) 10 % s t hp s out_r re s vdd out_p vpump vref 1 bottom view nc out_y gnd f s re s s leep 9 1 3 5 am101 3 6v1 9nf out 625dp s f s f s pin = ?0 ? (for e a ch a xi s ) out 2500dp s f s f s pin = ? 1 ? (for e a ch a xi s ) am101 3 7v1
package information L3G3250A 10/12 doc id 022118 rev 1 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack is an st trademark. figure 4. lga-16 (3.5x3.0x1.0): mechanical data and package dimensions dimen s ion s ref. mm min. typ. max. a1 1.000 1.027 a2 0. 8 00 a 3 0.200 d1 2. 8 50 3 .000 3 .150 e1 3 . 3 50 3 .500 3 .650 l1 1.000 1.060 l2 2.000 2.060 n1 0.500 n2 1.000 m 0.040 0.100 0.160 p1 0. 8 75 p2 1.275 t1 0.2 9 00. 3 50 0.410 t2 0.1 9 0 0.250 0. 3 10 d 0.150 k 0.050 lga-16 ( 3 .5x 3 .0x1.0 mm) land grid array packa g e outline and 8 2 9 75 8 2_a mechanical data
L3G3250A revision history doc id 022118 rev 1 11/12 5 revision history table 7. document revision history date revision changes 25-aug-2011 1 initial release.
L3G3250A 12/12 doc id 022118 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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